OMICURE U-24, an aromatic substituted urea, is intended for use as a latent accelerator for the dicyandiamide cure of epoxy resins. The addition of OMICURE U-24 to epoxy/ dicy formulations reduces the time and/or temperature required to cure these shelf stable one part products. OMICURE U-24M represents the micronized grade of OMICURE U-24. Compared to the other CVC substituted ureas, toluene bis dimethyl urea provides the greatest degree of acceleration to epoxy/dicy formulations. OMICURE U-24, at concentrations required to provide an equal degree of acceleration, will produce the least effect on cured properties. Suggested use levels of OMICURE U-24 are <5 phr. Curing can be accomplished in about 50 minutes at 100°C and in less than 3 minutes at temperatures >150°C. Cure times are dependent on the composition of the formulated product and your particular end application. Room temperature shelf lives (time to double viscosity) of >3 months can be obtained when <1 phr OMICURE U-24 is used with DGEBA/DICY. Some of the factors which can effect shelf life are formulation ingredients and compounding parameters. Ingredients in which OMICURE U-24 is insoluble at processing and storage temperatures will enhance overall storage stability. OMICURE U-24 can be incorporated into your formulation concurrent with the dicy addition.


Attribute Value
Cure to 95% Full Cure Times
@140C 7
@120C 20
Typical Properties
Appearance Clean Powder
Typical Peak Melting Point (C) 180-195
PHR with Dicyandiamide 1-5
Time to Double in Viscosity 10
Tg (C) 127
Particle Size - Regular Grade 80
Application Group Application Description  
North American Format International GHS Format European (REACH) Format

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