Epoxies for Electrical & Electronics

 

 Encapsulants 
Recommended ProductBenefits 
EPALLOY 5200
  • Low viscosity & good electrical properties 
EPALLOY 8220, 8220E, 8230 & 8230E
  • Low viscosity allows for good flow to lessen voids  
  • Product offers good mechanical properties & chemical resistance 
EPALLOY 8330, 8350 & 8370
  • Improved themal & chemical resistance
ERISYS GE-13, GE-21, GE-22, GE-29, GE-31 & GE-35
  • Lower viscosity with no shrinkage & excellent electrical properties
  • ERISYS GE-29 provides low viscosity & flame resistance 
  • ERISYS GE-35 is higher in functionality, providing flexibility, moisture resistance & resiliency 
OMICURE 24EMI
  • Used as sole curing agent (2-5 phr) or as accelerator for anhydride curing agents (1-3 phr)
OMICURE BC-120 
  • Low viscosity & long latency (up to 80oC).  Cures down to 125oC.

 

Note: Encapsulants are categorized as either potting compounds, glob-top encapsulants, underfills or molding compounds.

 

Insulating Varnish - Dip & VPI

 

Recommended ProductBenefits 
EPALLOY 8230
  • Low viscosity for good flow & less voids 
  • Good mechanical properties and chemical resistance 
EPALLOY 8330, 8350 & 8370 
  • Improved chemical & heat resistance
EPALLOY 5200
  • Low viscosity
ERISYS GE-8GE-20, GE-35 & GS-120 
  • ERISYS GE-20 provides good viscosity reduction & retention of thermal (up to 20%) and physical properties (beyond 30%).  There are no toxicity issues with GE-20 vs. GE-21
  • GE-35 is higher in functionality, providing flexibility, moisture resistance & resiliency 

 

Printed Circuit Boards

 

Recommended ProductBenefit
HyPox RK84
  • Provides a board that is dry to the touch
HyPox RF928
  • Provides high Tg toughening.
  • Reduces chipping, cracking & delamination.
EPALLOY 9000
  • Provides very high thermal performance (Tg)

 

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